What is reactive sputtering?

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Reactive sputtering is a method of film deposition, where a thin film is formed on a metal target by chemical reaction.

In reactive sputtering, a metal target is sputtered in the chamber with the usual Argon, along with a reaction gas such as oxygen and nitrogen. In some cases, introduction of reaction gases may lower the deposition rate, though the result depends on the target material.

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Glossary of vacuum technology related terms