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RDL (Redistribution Layer) is a wiring layer formed of Cu (Copper) and an insulating layer, used in WLP Fan-Out or 2.xD packaging structures. Its function is to connect the semiconductor chip to the board connector.
Plasma applications for RDL formation include:
・Descum (process of removing scum, residue of the photolithography process)
・Cleaning
・Hydrophilization of surface modified substrate
・Control of surface shape/uniformity of resin material
・Prevention of oxidation and corrosion of Cu wiring
WLP (Wafer-Level Packaging) manufacturing process
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