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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), the most prestigious package conference in Japan, will be held from May 31st to June 3h.
Date : May 31 to June 3,2022
Venue : San Diego, California, USA
Official Web site : https://www.ectc.net/index.cfm
ULVAC do presentation with following titles
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Session 20: Enhancements in Fine-Pitch Interconnects, Redistribution Layers and Through-Vias
“Novel Plasma Process for Build-Up Film in the Fine Wiring Fabrication”
Daisuke Hironiwa – ULVAC, Inc.
Yasuhiro Morikawa – ULVAC, Inc.
Atsuhito Ihori – ULVAC, Inc.
Ryuichiro Kamimura – ULVAC, Inc.
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Session 39: Interactive Presentations 3
“The Investigation of Dry Plasma Technology in Each Step for the Fabrication of High Performance Redistribution Layer”
Daisuke Hironiwa – ULVAC, Inc.
Haw Wen Chen – ULVAC, Inc.
Yasuhiro Morikawa – ULVAC, Inc.
Takashi Kurimoto – ULVAC, Inc.
Ryuichiro Kamimura – ULVAC, Inc.
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Related website :
・Dry ashing equipment for package
・Combined deposition and etch modules’ system of cluster type for advanced electronics