This post is also available in: Japanese

2022 International Conference on Electronics Packaging (ICEP), the most prestigious package conference in Japan, will be held as hybrid conference from May 11th to May 14thULVAC is “Gold sponsor” of ICEP.

Date : May 11-14, 2022

Venue: Sapporo Community Plaza, Hokkaido

Style: Hybrid conference (combining on-site and online presentations)

Official website : http://jiep.or.jp/icep/

Related website : ​

Dry ashing equipment for package

Combined deposition and etch modules’ system of cluster type for advanced electronics