Language：日本語
Based on its wealth of foundry experience, ULVAC supports a variety of MEMS production technologies, for applications ranging from microsensors to flow channel modules, optical switches, and bio-MEMSs.
Sputtering System
SME-200
Highly uniform and stable deposition technology on an 8 inch wafer scale utilizing specially designed sputtering chamber for dielectric materials.
ULVAC unique and stable process allowing high performance PZT thin film in mass production scale under 500degrees.
Load-lock type Sputtering System
CS-200
This is for research & development and small production application.
Batch-type High Vacuum Evaporation System
ei Series
This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate.
Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.
Cluster-type PE-CVD System
CME-200E/400
This is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.
Load-lock type Plasma-CVD System
CC-200/400
This is a compact and easy-to-use system for R&D use and production.
High-Density Plasma Etching System for R&D
NE-550EX
This is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
Dry Etching System for Opto-Devices, MEMS
NLD-5700
Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.
Ashing System
Luminous NA Series
This ashing system can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
