AC sputtering is a discharge system often used for high-resistance targets. It has a benefit of suppressing charge-up damage of the target surface, as two targets are discharged alternately.
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What is DC (direct current) sputtering?
DC sputtering is a discharge method in which a current has a constant voltage and a fixed flow direction.
… What is DC (direct current) sputtering?
What is sputtering?
Sputtering is a method of thin film deposition, which is a type of PVD (physical vapor deposition).
… What is sputtering?
What is the T/S distance?
T/S distance is the distance between the cathode and the substrate in a sputtering equipment, or more precisely, from the target surface of the cathode to the substrate. … What is the T/S distance?
What is step coverage?
Step coverage refers to the state of film coverage when a film is deposited on an uneven surface of a substrate (the surface perpendicular to the evaporation source) by sputtering, vapor deposition, etc. … What is step coverage?
What are backing plates?
Backing plates are one of the components of a sputtering cathode. It is shaped to fit the target and attached on the backside of the target. … What are backing plates?
What is ion implantation?
Ion implantation is a method of implanting impurities to a semiconductor substrate by ionizing the substance or impurities and accelerating the ion into the substrate. … What is ion implantation?
What is ion beam milling?
Ion beam milling is a technique in which the convex parts of a film is flattened and scraped off by an ion beam. … What is ion beam milling?
What is RF (radio frequency) sputtering?
In RF sputtering, high frequency alternating current is applied to a vacuum chamber and a target. It is used for metals, ceramics, silica, oxides, metal oxides, nitrides, insulators, etc.
… What is RF (radio frequency) sputtering?
What is magnetron sputtering?
Magnetron sputtering is the mainstream method of sputtering which utilizes magnets.