NANOMETAL INKs are produced by the Gas Evaporation Method. These newly developed inks consist of metal nanoparticles dispersed stably and not aggregated in some organic solvent. The inks enable to form electro-conductive fine patterns directly by printing processes such as ink-jet printing.
Ag NANOMETAL INK enables to form Ag films at the curing temperature of 230℃.
Ag NANOMETAL INK (Solvent: Toluene)
Ag NANOMETAL INK (Solvent: Tetradecane) Ink-jet Type
TEM image of Ag nanoparticles dispersed in Ag NANOMETAL INK Average particle size is 7.8nm
■Particle size distribution of Ag NANOMETAL INK
■Electric resistivity vs. curing temperature of Ag NANOMETAL INK films
■Viscosity vs. temperature of Ag NANOMETAL INK
Product Name | Au NANOMETAL INK | Ag NANOMETAL INK |
Ag NANOMETAL INK |
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Grade | Au1T | Au1Chb | Ag1T | Ag1TeH | L-Ag1T | L-Ag1TeH |
For Ink-Jet | X | ○ | X | ○ | X | ○ |
Metal concentration(wt%) | 30 | 50-60 | 30 | 50-60 | 30 | 50-60 |
Solvent | Toluene | Cyclohexylbenzene | Toluene | Tetradecane | Toluene | Tetradecane |
Average Particle Size (nm) |
3-8 | 3-8 | 3-8 | |||
Viscocity (mPa・s) | <5 | 5-15 | <5 | 5-15 | <5 | 5-15 |
Coating characteristic | ||||||
Curing Condition | 250℃×60min (in Air) | 230℃×60min (in Air) | 150℃×60min (in Air) | |||
Thickness(μm) | <1 | <1 | <1 | |||
Resistivity (μΩ・cm) | approx.8 | approx.20 | approx.3 | approx.10 | ||
Substrate to be used |
Heat-resistant temperature of substrates should be higher than sintering temperature. (example:polyimide, glass, metal, ceramic etc.) |
Specifications are subject to change.
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