Multi-Chamber Deposition System Model: ENTRON-EXX|Sputtering System|Load-lock type|Products|ULVAC, Inc.
Sputtering System
Load-lock type

Multi-Chamber Deposition System Model: ENTRON-EXX

The ENTRON-EXX is a versatile, multi-chamber platform designed to support the production of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging. By integrating a variety of process modules̶such as PVD, CVD, ALD, pre-clean, heating, cooling̶with enhanced data collection and analysis capabilities, the ENTRON-EXX provides customers with an optimized environment for both development and mass production.

Features

  • Maximization of Factory Space Efficiency:
    The ENTRON-EXX offers two versatile platform options, Single and Tandem*, enabling customers to select the best platform to fit their factory spaces, thereby achieving maximum productivity per unit of space.
  • Highly Scalable Equipment Design:
    ・Its flexible design enables quick module additions and swaps, providing flexibility to adapt to changing needs.
    ・Capable of accommodating up to 12 modules (PVD, ALD, CVD, Degas, Cool, etc.).
  • Enhanced Data Collection and Analysis Capabilities:
    It has significantly upgraded data collection and analysis capabilities to improve yield, support preventive maintenance, and drive operational efficiency.

*A Single platform features a single transfer chamber (Core), offering a simple and space-efficient design. A Tandem platform features two transfer chambers (Cores) arranged in sequence, ideal for complex processes that require higher productivity.

Applications

  • Semiconductor manufacturing process

Product Introduction Video

The product information for the conventional model: ENTRONTM-EX W300

This website use cookies to obtain and use access data to understand the convenience and usage of customers. If you agree to use cookies, click "I Accept".
[Privacy Plicy] [Cookie Policy]

I Accept