No.80 February/2017

1. パネルレベル高密度実装ソリューション

執筆者 半導体電子技術研究所 森川 泰宏 他
概要 High-density packaging technologies such as 3D, 2.5/2.1D scheme basing on PCB (Print Circuit Board) substrate are among key technologies to satisfy the requirements from the both smart semiconductor devices and smart functional devices. ULVAC has been continuously developing manufacturing solutions for high-density packaging. In this paper, buildup multilayer technology solutions consisting of etching, ashing and PVD (Physical Vapor Deposition) sputtering to make the high density interconnection PCB panel substrate, will be introduced.

2. アルバックにおけるMRAM向け量産技術開発

執筆者 半導体電子技術研究所 山本 弘輝 他
概要 We have been developing sputtering tool for MRAM mass production, with simple module configuration and smaller footprint. It provides stable magnetic Co films and low damage MgO film with RA uniformity of 3.5%. Novel wide temperature process from -170℃ to 600℃ to fabricate excellent MTJ layers, will also be introduced.

3. ニオブ超伝導加速空洞の開発

執筆者 未来技術研究所 永田 智啓 他
概要 We study about Niobium refining and elliptical cavity fabrication process for superconducting cavity. In order to carry out Niobium purification, 600 kW electron beam melting furnace was introduced in our factory. It makes possible the stable refining to obtain a cavity quality grade by optimization of melting condition. We performed the trial manufacturing of two single cell cavities are made from our high purity Niobium ingots (RRR>300). Maximum accelerating voltage of weldingtype and seamless - type cavities were achieved 41 MV/m and 37 MV/m at 2K, respectively. These values surpass the specification of international linear collider project. Also, seamless tube for three cell cavity was prepared as scale up study. Because an average grain size in the tube for three cell is smaller than that for single cell, it is expected that smoother surface is obtained after hydrofroming process.

4. 高安定性と長寿命を実現した熱陰極電離真空計「G-TRANシリーズ ST2」

執筆者 規格品事業部 中島 豊昭 他
概要 Because of changes in the operating environment and the material processing with the vacuum equipment, lowering and fluctuation of the reading value of the ionization vacuum gauge has increased. Therefore, we focused on the triode ionization vacuum gauge that has a feature of high stability and high accuracy, we developed the world's first small metal type gauge head of triode ionization vacuum gauge. In environments such as oil is deposited, it was confirmed that a long period of time the reading value is more stable than the cold cathode ionization vacuum gauge and B-A ionization vacuum gauge.This triode ionization vacuum gauge that we have developed is an old technology, but we believe can contribute to solution in the new market.

5. 液体窒素ジェネレーター「EMPシリーズ」の紹介と新製品「UMP-40W」について

執筆者 アルバック・クライオ株式会社
低温機器技術部 早坂 千明 他
概要 ULVAC CRYOGENICS INCORPORATED (UCI) has been a leading provider of cryopumps, and on May 2014, it has been transferred the technology of cryocooler applied equipments from IWATANI INDUSTRIAL GASES CORPORATION (IIG). Now UCI has successfully fused its existing cryocooler and liquid nitrogen generator from IIG into new liquid nitrogen generator,“ UMP-40W”. UCI now plans to actively promote sales of“ UMP-40W” globally. We will discuss in detail the transfer of technology.

6.新しい応用分野を切り開く硬X線光電子分光分析装置:「PHI Quantes」

執筆者 アルバック・ファイ株式会社
技術開発部 渡邉 勝巳 他
概要 A newly developed “PHI Quantes” is introduced, which enables both XPS(X-ray Photoelectron Spectroscopy) and HAXPES(Hard X-ray Photoelectron Spectroscopy) by using Al Kα and Cr Kα, respectively. HAXPES has advantages comparing with ordinary XPS, such as deeper analysis depth to several 10 nm, surface contamination free analysis, nondestructive interface analysis and chemical state analysis by measuring inner shell electron. Some latest applications are also demonstrated to show the capability of “ PHI Quantes”.