TECHNICAL JOURNAL No.81E January/2018
Abstract

1. Development of Sputtering system“ SMD3400” For G10.5 mother glass

Author Yuusuke MIZUNO, et al., Institute for Super Material
Abstruct “SMD 3400” is the large-scaled sputtering system, manufactured and developed for use in Generation 10.5 (G10.5), which
mother glass size is approximately 3400×3000 mm, for TFT-LCD production line. ”SMD 3400” is composed of Loading/ Unloading position, Loading/Unloading chamber, heating chamber and 2 sputtering chambers. Planer targets of Cu and ITO  are mounted respectively on the sputtering chamber in multi-cathode systems. This sputtering system has improved  horizontal wave-formed thickness uniformity problem depends on the cathode arrangement by using new-type deposition  method, although conventionally film thickness become thicker right in front of the target and thinner at between the  targets. This new-type deposition method has successfully introduced to “SMD2400”so far, which established mass  production technology to improve luminance unevenness in display due to horizontal wave-formed thickness uniformity.
We investigated film thickness uniformity, Rs uniformity, reflectance (for Cu), transmittance (for ITO) and film stress in the Cu and ITO process using “SMD3400”. We obtained film thickness uniformity less than 10% in both process as we expected by the simulation. We confirmed new-type deposition method improve Rs horizontal distribution. And good Rs uniformity, reflectance, transmittance and film stress were obtained at G10.5 substrate area.

2. Development of High Resistivity Transparent Conductive Oxide Electrode using Sputtering Process

Author Hirohisa TAKAHASHI et al., Institute of Super Material
Abstruct For the In-Cell type touch screen panel, a high resistivity transparent electrode that can work as anti-static without  affecting touch sensing is required. ULVAC selected Sputtering Process which is high in productivity and suitable for large  size and successfully developed a high resistivity transparent conductive oxide electrode satisfying required specification.

3. The printed circuit manufacturing using the nano metal ink and fabrication of transparent fine electrodes by gravure offset printing

Author Natsuki HASHIMOTO, et al., Future Technology Research Laboratory
Abstruct We introduce silver nanoparticle ink, namely nanometal ink, which is essential for printed electronics. In recent, flexibility is required in the field of transparent electrodes for future flexible devices. Although indium tin oxide (ITO) is the most widespread material as transparent electrode, its lack of adequate flexibility and poor conductivity restrain from further development for future devices.
We have attempted to make patterns of invisible and high conductive fine silver electrodes by a gravure offset printing method to meet both of transparency and flexibility. Here, silver nanoparticle ink was developed and applied to fabricate fine invisible silver electrodes with the line width of 5 μm. The fabricated electrode pattern of which the line/space is 5 μm /  300 μm has excellent electric conductivity and transparency. The patterned electrode has sheet resistance of sub-10 Ω/ □ ,  while its transparency is higher than 90.

4. Crystal growth of quantum dot phosphors and their application to photoelectric conversion device

Author Junki NAGAKUBO, et al., Future Technology Research Laboratory
Abstruct In order to obtain semiconductor quantum dots with superior opto-electronic performance, several technologies are required including epitaxial growth, fine particle size control, and ligand control. We have synthesized quantum dot  phosphors via these technologies. The quantum dot phosphors showed better color purity (full width at half maximum:  45.0 nm, chromaticity coordinates: 0.177, 0.688) than conventional phosphors such as β -SiAlON. A photoelectric converter using these quantum dots has been fabricated, which shows 16.7% of external quantum efficiency at 850 nm of infrared light. The result indicates a possibility of developing superior infrared image sensor than conventional organic CMOS image sensors.

5. Development of a quartz crystal resonator with a resonance frequency of 4 MHz

Author Atsushi ITO, Components Division
Abstruct A quartz crystal microbalance (QCM) is typically used to monitor the vapor deposition of organic materials, and QCM sensors feature a quartz crystal resonator with a resonance frequency of 5 or 6 MHz. When a metal or oxide film forms on a sensor, the rate at which the material adheres varies little. When an organic film forms on a sensor, however, the rate at which the material adheres varies considerably. This causes a problem since it greatly reduces the life of the quartz crystal resonator. The current work used several quartz crystal resonators with different fundamental frequencies to measure electrical and temperature characteristics during formation of an organic film. Results indicated that a quartz cr ystal resonator with a resonance frequency of 4 MHz or lower was better suited to sensing vapor deposition of an organic material than a resonator with a resonance frequency of 5 or 6 MHz.

6.Advanced Spectra Interpretation in TOF-SIMS“ Parallel Imaging MS/MS”

Author Shin-ichi IIDA, et al., ULVAC-PHI, INC.
Abstruct Recently, the applications of TOF-SIMS have expanded into a wide variety of organic materials, because the sensitivity of high mass molecular ions was improved dramatically. However, it was very difficult to determine the chemical formula from the measured mass above m/z 200. The ambiguous peak identification was a significant problem in TOF-SIMS. In order to determine the chemical formula as well as detailed chemical structure, we developed the TOF-SIMS instrument equipped
with Tandem MS (MS/MS), and applied it to analysis of various organic materials. In this article, we will introduce this unique instrument, and demonstrate the results of the spectra analysis using MS/MS.