MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.
Specification | MLXTM-3000N | |
Configuration | Transfer system | 6sides transfer module x 1 |
Module | Load/Unload module: 2modules (or 1module and 1degas) Process module: MAX 4 modules |
|
Wafer Size | 75mm - 200mm diameter (3 to 8 inch) | |
Transfer robot | Vacuum transfer robot with double pick-up | |
Control system | PC control system | |
Application | Power Device (Front side and Back side), UBM, Mounted Device, SAW Device. Non-Standard Shaped Wafers | |
Pumping systems | Main Pump | Load/Unload module : Dry Pump Transfer module : TMP Process module : Cryo Pump |
Roughing Pump | Dry Pump | |
Process Gas Line | MAX 3 lines | |
Ultimate pressure | Transfer: 1.3 x 10E-4Pa (1.0 x 10E-6Torr) Process module: 1.0 x 10E-5Pa (7.5 x 10E-8Torr) |
|
Electricity | 50Hz/60Hz, 3Phase, AC 200V | |
Cooling Water | 0.2 - 0.3MPa, Temperature 20 - 25ºC, 100L/min | |
Gas | Process Gas: 0.05 - 0.1MPa (Dependent on Variety Gas) Nitrogen : 0.05 - 0.1MPa |
|
Compressed Air | 0.55 - 0.75MPa | |
Grounding | A Class (1st Class) Ground line (10 ohm on less) | |
Option | 3" to 8" (75mm to 200mm diameter) wafer available | |
Shutter mechanism | ||
Electrostatic chuck | ||
RGA: Qulee | ||
Loadlock module (optional TMP available) |
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