Sputtering System
Load-lock type
Load-lock type
Multi-chamber Sputtering SystemMLXTM-3000N
MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.
Features
- Wafer size: 3 to 8 inch (75 to 200mm)
- Accurate film quality control is available with precise parameter control under contamination free environment
- Flexibilities of various process such as thick Alminium, TTH Bawiermotal and staokfilm.
Applications
- Metallization for semiconductor devices such as Power device etc.
Specification
| Specification | MLXTM-3000N | |
| Configuration | Transfer system | 6sides transfer module x 1 |
| Module | Load/Unload module: 2modules (or 1module and 1degas) Process module: MAX 4 modules |
|
| Wafer Size | 75mm - 200mm diameter (3 to 8 inch) | |
| Transfer robot | Vacuum transfer robot with double pick-up | |
| Control system | PC control system | |
| Application | Power Device (Front side and Back side), UBM, Mounted Device, SAW Device. Non-Standard Shaped Wafers | |
| Pumping systems | Main Pump | Load/Unload module : Dry Pump Transfer module : TMP Process module : Cryo Pump |
| Roughing Pump | Dry Pump | |
| Process Gas Line | MAX 3 lines | |
| Ultimate pressure | Transfer: 1.3 x 10E-4Pa (1.0 x 10E-6Torr) Process module: 1.0 x 10E-5Pa (7.5 x 10E-8Torr) |
|
| Electricity | 50Hz/60Hz, 3Phase, AC 200V | |
| Cooling Water | 0.2 - 0.3MPa, Temperature 20 - 25ºC, 100L/min | |
| Gas | Process Gas: 0.05 - 0.1MPa (Dependent on Variety Gas) Nitrogen : 0.05 - 0.1MPa |
|
| Compressed Air | 0.55 - 0.75MPa | |
| Grounding | A Class (1st Class) Ground line (10 ohm on less) | |
| Option | 3" to 8" (75mm to 200mm diameter) wafer available | |
| Shutter mechanism | ||
| Electrostatic chuck | ||
| RGA: Qulee | ||
| Loadlock module (optional TMP available) | ||