Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model, and carousel types for large-volume substrate processing.
SV-200 | SV-4540 | SV-6040 | SV-9045 | |
Standard evacuation system | 8-inch cryopump | 12-inch cryopump | 12-inch cryopump | 16-inch cryopump |
Final pressure | 6.7e-5Pa | 6.7e-5Pa | 6.7e-5Pa | 6.7e-5Pa |
Deposition direction | Side | Side | Side | Side |
Deposition area uniformity Static Rotary | Φ200mm ± 5% | L300mm ± 10% | L300mm ± 10% | L400mm ± 10% |
Substrate heating | None | 250°C | 250°C | 250°C |
Control system | Automatic | Automatic | Automatic | Automatic |
Options (except SV-200) | Turbo pump | Drainage cold electrode |
Oil diffusion pump | APC mechanism | |
Simultaneous multi-source deposition | Substrate reversing mechanism | |
Down deposition | Reactive sputter | |
Conventional cathode | ||
Cathode for strong magnets | ||
RF etch cleaning (SV-4540) | ||
Bias mechanism (SV-4540) |
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