ULVAC will be presenting on polyimide fine-via etching and low-damage surface-modification process for high-density FOWLP at ECTC2020|News|ULVAC, Inc.
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2020.05.26
News

ULVAC will be presenting on polyimide fine-via etching and low-damage surface-modification process for high-density FOWLP at ECTC2020

ULVAC will be presenting on polyimide fine-via etching and low-damage surface-modification process for high-density FOWLP at ECTC 2020.ULVAC will be presenting on polyimide fine-via etching and low-damage surface-modification process for high-density FOWLP at ECTC 2020.


Title: "Polyimide Fine-via Etching and Low-damage Surface-modification Process For High-density Fan-out Wafer Level Package"

Date: June 3 - 30, 2020, Virtual conference (Session 20)

External Links

・ IEEE ECTC2020

https://www.ectc.net/index.cfm

・ Registration for virtual conference

https://www.ectc.net/registration/index.cfm

For futurer information

ULVAC, Inc. web_info

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