ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions.
ULVAC Group is sponsoring this event as a Gold Sponsor. We also contribute to the organization of this conference as a member of the ICEP Technical Program Committee and Operation Committee.
| DATE | April 17-20, 2024 (JST) |
|---|---|
| LOCATION | Toyama International Conference Center, Toyama Pref., Japan |
External Links
https://www.jiep.or.jp/icep/about.html
https://www.jiep.or.jp/icep/program.html
For further information
ULVAC, Inc. web_info
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