Process technology for BAW device

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ULVAC provides the piezoelectric film processing technology and electrode formation technology required for BAW device production.

Sputtering Piezo layer

Performance of Piezoelectric layre (Sc)AlN

Etching Piezo layer(ScAlN)

Achieves minimum amount of digging of base electrode, high etch rate, and long-term maintenance-free

 

Electrode and AlN etching

Not only ScAlN, but also other materials in BAW process have been etched and mass-produced.