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MPS Series

Sputtering System

Ultra-High Vacuum Sputtering System for R&D
MPS Series

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MPS8000

ULVAC's MPS Series are a new type developed using our wealth of experience and extensive sales record. Discharge can be maintained at a pressure, about one order of magnitude lower than the conventional sputter discharge pressure. The use of long throw sputtering enables better film thickness uniformity, and the diagonal incidence configuration is ideal for co-sputter and multilayer films.

Features

  • Low-pressure processesCan maintain discharge at the range of pressure, roughly one order of magnitude lower than the conventional sputter discharge pressure.
  • Good film thickness uniformityExtremely good film thickness uniformity even with targets of the same diameter as the substrate.
  • Stable low rate control LTS cathode enables the film thickness to be controlled to within a few angstroms.
  • Compact equipment layout Stores multi-element cathodes in a single chamber, eliminating the need for the multiple chambers of conventional systems, and enabling a compact design.

Applications

  • Research and development

Specifications

MPS-8000-C8
Number of mounted cathodes Up to 8
Uniform magnetic field application mechanism Available as option
Ultimate pressure 7 x 10-7Pa max.
Substrate size 200 mm diameter max.
Maximum gas supply rate Ar : 50sccm
Target size 50 mm diameter
Operation PC system (GPCS)
Preparation chamber Provided standard
Deposition chamber pumping system Turbomolecular pump
System dimensions (W x D x H) 3700mm x 4700mm x 2500mm

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