MagestTM S200 provides the multi-layer deposition of ultra thin films under the ultra high vacuum condition and is applicable for the deposition of various materials by RF or DC sputtering.
|Loading/unloading chamber||1||Wafer stocker type|
|Transfer chamber||1||Double arm type|
|Pre-cleaning chamber||1||LT-ICP etching|
|Deposition chambers||4||Triple-gun cathode|
|Oxidation chamber||1||ISM radical oxidation|
|Deposition Film types||MgO, Ta, NiFe, Pt, PtMn, CoFe, Ru, Al, other|