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MagestTM S200

Sputtering System

Magnetic Multilayer Cluster Tool
MagestTM S200

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MagestTM S200 provides the multi-layer deposition of ultra thin films under the ultra high vacuum condition and is applicable for the deposition of various materials by RF or DC sputtering.

Features

  • UHV (ultra-high vacuum) processes.
  • Triple-gun cathode.
  • Outstanding controllability and reproducibility with ultra-thin films of 10 nm or less
  • Excellent contorol of magnetic anisotropy and coercive force

Applications

  • MRAM and Magnetic Divice
  • Materials development

Specifications

Loading/unloading chamber 1 Wafer stocker type
Transfer chamber 1 Double arm type
Pre-cleaning chamber 1 LT-ICP etching
Deposition chambers 4 Triple-gun cathode
Oxidation chamber 1 ISM radical oxidation
Deposition Film types MgO, Ta, NiFe, Pt, PtMn, CoFe, Ru, Al, other

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