ULVAC’s sputtering systems have the best track record in the industry.
“Feature story : Flat Panel LCD TVs and Vacuum”
ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series.
The ULDiS series is the digital sputtering system that has enhanced the Meta Mode and realized the high-quality optical filters and coatings.
ULVAC has signed a License Agreement with JDS Uniphase Corporation of the U.S.
; License MetaMode® sputter for optical application. The ULDiS comes available to be placed at your business, and develops widely.
The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and ITO films. ULVAC has delivered a large number of these systems, for use in a wide range of production environments. ULVAC responds rapidly to feedback from production sites to improve the reliability of these models.
With the increase in size of LCD panels and manufacturing mother glass, manufacturing equipment has also become larger, requiring ever-larger equipment investments. For the past several years, ULVAC has been responding to increasing mother glass sizes by developing new-concept systems to replace the cluster-type systems currently prevalent. ULVAC's systems support larger substrate sizes while remaining compact and low-priced. The new concepts they employ enable staggered, highly effective investment with low initial outlay.
ULVAC's MPS Series are a new type developed using our wealth of experience and extensive sales record. Discharge can be maintained at a pressure, about one order of magnitude lower than the conventional sputter discharge pressure. The use of long throw sputtering enables better film thickness uniformity, and the diagonal incidence configuration is ideal for co-sputter and multilayer films.
Multi-chamber Sputtering System ENTRONTM-EX2 W300 is the latest platform possible to combine the various process.
The high-end model with extendibility that can be correspond with customer’s demand of high throughput and saving energy, etc. for next generation. ULVAC will answer customer's needs by various lineup like the high advanced PVD, CVD and ALD module for nano wiring by our original technology.