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Etching System
Si Deep Etching System NLD-5700Si
This system enable deep Si etching using ULVAC original process, doesn't use Bosch process nor Cyro Genics process. This system is also available for quartz etching.
Features
Good repeatability and stable process.
High selectivity to Photo Resist (200 - 500), good control for CD shift.
Smooth side wall after etching.
Can do etching of ultra fine devices (<100nm) and high aspect ratio devices.
Can do deep etching of glass substrate (quartz, Pyrex).