This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.
|System configuration||atmospheric cassettes + atmospheric transfer + etching chamber|
|Transfer mechanism||Pneumatic manipulator (atmospheric transfer)|
|Applicable substrate thickness||φ150mm x 1|
|Plasma method||CCP (ICP is option)|