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Thin-film Lithium Ion Secondary Battery
ULVAC offers integrated production technologies for advanced secondary batteries developed for use in small electronic devices and biomedical devices and in combination with energy harvesting devices.
Batch-type Sputtering System SX series is for batch type sputtering system for research & development and small production application.
It is possible to arrange for various module conbination; Atmospheric cassette, Single piece, Atmospheric transfer, Vaccum transfer. Compact design integrated with control unit.
Load-lock type Sputtering System CS 200 is for research & development and small production application.
SME-200E is cluster type Sputtering system for research and development and production purpose.
EW Series models are deposition systems for evaporation of metal or oxides onto continuously-wound plastic film, paper or metal foil. Models range from compact types for research, to systems for mass-production. They can be used to manufacture products such as packaging materials, capacitors and magnetic tape.
This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.
CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.
This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.
This is a load-lock type material evaporation system for R&D use which deposits organic films, alkali metal films and metal films.
Vapor Deposition Polymerization
VEP Series models are systems for deposition of various organic and inorganic materials by methods including evaporation, sputtering, plasma metallization and evaporation metallization. Process chambers can be freely selected to match the application.