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Semiconductor Process (Non Volatile Memory)

ULVAC offers next-generation leading technologies, such as sputtering and dry etching for various logic and memory devices.

Sputtering/CVD

Multi-chamber Sputtering System
ENTRONTM-EX2 W300

entron_ex2w300

Multi-chamber Sputtering System ENTRONTM-EX2 W300 is the latest platform possible to combine the various process.

The high-end model with extendibility that can be correspond with customer’s demand of high throughput and saving energy, etc. for next generation. ULVAC will answer customer's needs by various lineup like the high advanced PVD, CVD and ALD module for nano wiring by our original technology.

Magnetic Multilayer Cluster Tool
MagestTM S200

magest

MagestTM S200 provides the multi-layer deposition of ultra thin films under the ultra high vacuum condition and is applicable for the deposition of various materials by RF or DC sputtering.

Etching

High-Density Plasma Etching System for R&D
NE-550EX

NE-550H

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Non-volatile Material Etching Tool
ULHITETM NE-7800H

NE7800

ULHITETM NE-7800H is the cluster type etching system of low-pressure and high-density plasma for NVM materials(difficult etch materials, used for FeRAM, MRAM, ReRAM, CBRAM, PCRAM etc.),dielectric, noble metals and Magnetic Layers.