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Semiconductor Process (FEOL/BEOL)

ULVAC offers next-generation leading technologies, such as sputtering, CVD, ALD, dry cleaning and dry etching for various logic and memory devices.

Native Oxide Removal

A Batch System to Remove Native Oxide
RISETM-300

rise300

Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.

Sputtering

Multi-chamber Sputtering System
MLXTM-3000N

mlx3000n

MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

Multi-chamber Sputtering System
ENTRONTM-EX2 W300

entron_ex2w300

Multi-chamber Sputtering System ENTRONTM-EX2 W300 is the latest platform possible to combine the various process.

The high-end model with extendibility that can be correspond with customer’s demand of high throughput and saving energy, etc. for next generation. ULVAC will answer customer's needs by various lineup like the high advanced PVD, CVD and ALD module for nano wiring by our original technology.

Magnetic Multilayer Cluster Tool
MagestTM S200

magest

MagestTM S200 provides the multi-layer deposition of ultra thin films under the ultra high vacuum condition and is applicable for the deposition of various materials by RF or DC sputtering.

CVD/ALD

Multi-chamber Sputtering System
ENTRONTM-EX2 W300

entron_ex2w300

Multi-chamber Sputtering System ENTRONTM-EX2 W300 is the latest platform possible to combine the various process.

The high-end model with extendibility that can be correspond with customer’s demand of high throughput and saving energy, etc. for next generation. ULVAC will answer customer's needs by various lineup like the high advanced PVD, CVD and ALD module for nano wiring by our original technology.