EQUIPMENT

Top > EQUIPMENT > APPLICATIONS > Power Device > Front-Side > Sputtering >

Sputtering

Multi Chamber Type Equipment
ENTRONTM N300

entron-n300

ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series. 

Backside Metalization Sputtering System
SRH Series

SRH-420

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Multi-chamber Sputtering System
MLXTM-3000N

mlx3000n

MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

Load-lock type Sputtering System
CS-200

CS200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.

▲Return to Top