This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.
ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series.