EQUIPMENT

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Front-Side

Etching

Compact Etcher for Reserch & Development
CE-L

CE-L

This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.

High-Density Plasma Etching System for R&D
NE-550EX

NE-550H

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Dry Etching System for Production
NE-5700/NE-7800

ne7800h

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

Dry Etching System for R&D
NLD-570

NLD570

Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Dry Etching System for Opto-Devices, MEMS
NLD-5700

nld5700

Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Ashing

Ashing Systems
Luminous NA Series

NA-1300L full module

Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

Ion Implant

High-energy Ion Implanter SOPHI-400

SOPHI-400

SOPHI-400 is a cluster type, high-energy ion implanter applicable to 2400 keV.

High-temp Ion Implanter for SiC
IH-860DSIC

ih860dsic

Ion Implanter for mass production with high temp ESC for SiC.

Medium Current Ion Implanter
SOPHI-200/260

sophi-200

This tool, SOPHI-200/260, basically inherits exisiting medium current production model ion implanter, and remove over specification based on our sufficient experience as tool supplier. Therefore, thanks to effective cost reduction, we can offer inexpensive sales price with parallel scan capability.

Sputtering

Multi Chamber Type Equipment
ENTRONTM N300

entron-n300

ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series. 

Backside Metalization Sputtering System
SRH Series

SRH-420

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Multi-chamber Sputtering System
MLXTM-3000N

mlx3000n

MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

Load-lock type Sputtering System
CS-200

CS200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.