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Back-Side

Ion Implant

High-energy Ion Implanter SOPHI-400

SOPHI-400

SOPHI-400 is a cluster type, high-energy ion implanter applicable to 2400 keV.

Low-acceleration and High-density Ion Implanter SOPHI-30

SOPHI-30

SOPHI-30, cluster type low-acceleration and high-density ion implanter, has no mass separator and supports thin wafers.

Medium Current Ion Implanter
SOPHI-200/260

sophi-200

This tool, SOPHI-200/260, basically inherits exisiting medium current production model ion implanter, and remove over specification based on our sufficient experience as tool supplier. Therefore, thanks to effective cost reduction, we can offer inexpensive sales price with parallel scan capability.

Sputtering

Multi Chamber Type Equipment
ENTRONTM N300

entron-n300

ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series. 

Backside Metalization Sputtering System
SRH Series

SRH-420

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Load-lock type Sputtering System
CS-200

CS200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.

Evaporation

Small Evaporation System for R&D
EX-200

EX_200

This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.

Load-lock type Evaporation System
CV-200

cv200

CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.

Batch-type High Vacuum Evaroration System
ei Series

ei

This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.