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R&D

Sputtering

Holizontal In-line Type Sputtering System
SCH Series

SCH

The SCH Series are horizontal in-line sputtering systems for deposition of transparent conductive films and other metal films. They can be used to depositi films such as back conatct and barrier layers in solar cell production lines.

Batch-type Sputtering System
SX Series

sx-200

Batch-type Sputtering System SX series is for batch type sputtering system for research & development and small production application.

Compact Sputter for Research & Development
CS-L

cs-l

It is possible to arrange for various module conbination; Atmospheric cassette, Single piece, Atmospheric transfer, Vaccum transfer. Compact design integrated with control unit.

Batch-type Sputtering Systems
SV Series

sv

Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model, and carousel types for large-volume substrate processing.

Load-lock type Sputtering System
CS-200

CS200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.

CVD

Cluster-type PE-CVD System
CME-200E/400/500

cme200e

CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.

Load-lock type Plasma-CVD System
CC-200/400

cc200400

CC-200/400 is a compact and easy-to-use system for R&D use and production.

Evaporation

Small Evaporation System for R&D
EX-200

EX_200

This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.

Multi-chamber type Evaporation System
EME-400

eme400

EME-400 is the Multi-Chamber type Load Lock system with hexagonal shape core chamber. Transfer chamber is located in the center that is connected with each deposition chamber separated, and substrate is transferred by robot. The simultaneous deposition for mass production is available free of contamination.

Load-lock type Evaporation System
CV-200

cv200

CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.

Batch-type High Vacuum Evaroration System
ei Series

ei

This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.