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MEMS Device

Based on its wealth of foundry experience, ULVAC supports a variety of MEMS production technologies, for applications ranging from microsensors to flow channel modules, optical switches, and bio-MEMSs.

Etching

Compact Etcher for Reserch & Development
CE-L

CE-L

This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.

Dry Etching System for Production
NE-5700/NE-7800

ne7800h

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

High-Density Plasma Etching System for R&D
NE-550EX

NE-550H

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Dry Etching System for R&D
NLD-570

NLD570

Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Si Deep Etching System
NLD-5700Si

nld-si

This system enable deep Si etching using ULVAC original process, doesn't use Bosch process nor Cyro Genics process. This system is also available for quartz etching.

Dry Etching System for Opto-Devices, MEMS
NLD-5700

nld5700

Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Ashing

Ashing Systems
Luminous NA Series

NA-1300L full module

Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

Sputtering

Backside Metalization Sputtering System
SRH Series

SRH-420

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Batch-type Sputtering System
SX Series

sx-200

Batch-type Sputtering System SX series is for batch type sputtering system for research & development and small production application.

Compact Sputter
ACS-4000

ACS4000-equip

Compact sputtering system is available for research and development of multi layer thin film, compound materials or other devices, using automatic process operation by PC. Also more large size substrate (4 inch dia.) than ever system is available.

Compact Sputter for Research & Development
CS-L

cs-l

It is possible to arrange for various module conbination; Atmospheric cassette, Single piece, Atmospheric transfer, Vaccum transfer. Compact design integrated with control unit.

Multi-chamber Sputtering System
MLXTM-3000N

mlx3000n

MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

Load-lock type Sputtering System
CS-200

CS200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.

Evaporation

Small Evaporation System for R&D
EX-200

EX_200

This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.

Load-lock type Evaporation System
CV-200

cv200

CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.

Batch-type High Vacuum Evaroration System
ei Series

ei

This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.

Organic Material Evaporation System for R&D
Mini-Lab

mini_lab

This is a load-lock type material evaporation system for R&D use which deposits organic films, alkali metal films and metal films.

CVD

Carbon Nanotube Growth Experimenting System
CN-CVD-400

cncvd400_800

ULVAC developed the technique for growing carbon nanotube vertically and selectively on a substrate for the first time in the world. By using the microwave plasma CVD technique, ULVAC has succeeded in mass production of nanotubes with high purity. Drastic improvement of performance can be expected in many fields, including cells and storage of hydrogen.

Organic/Inorganic Compound Deposition Systems
VEP Series

vep

VEP Series models are systems for deposition of various organic and inorganic materials by methods including evaporation, sputtering, plasma metallization and evaporation metallization. Process chambers can be freely selected to match the application.

Cluster-type PE-CVD System
CME-200E/400/500

cme200e

CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.

Load-lock type Plasma-CVD System
CC-200/400

cc200400

CC-200/400 is a compact and easy-to-use system for R&D use and production.

Development Prototype