This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

This system enable deep Si etching using ULVAC original process, doesn't use Bosch process nor Cyro Genics process. This system is also available for quartz etching.

Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Batch-type Sputtering System SX series is for batch type sputtering system for research & development and small production application.

Compact sputtering system is available for research and development of multi layer thin film, compound materials or other devices, using automatic process operation by PC. Also more large size substrate (4 inch dia.) than ever system is available.

It is possible to arrange for various module conbination; Atmospheric cassette, Single piece, Atmospheric transfer, Vaccum transfer. Compact design integrated with control unit.

MLX^TM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

Load-lock type Sputtering System CS 200 is for research & development and small production application.

SME-200E is cluster type Sputtering system for research and development and production purpose.

This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.

CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.

This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.

This is a load-lock type material evaporation system for R&D use which deposits organic films, alkali metal films and metal films.

ULVAC developed the technique for growing carbon nanotube vertically and selectively on a substrate for the first time in the world. By using the microwave plasma CVD technique, ULVAC has succeeded in mass production of nanotubes with high purity. Drastic improvement of performance can be expected in many fields, including cells and storage of hydrogen.

VEP Series models are systems for deposition of various organic and inorganic materials by methods including evaporation, sputtering, plasma metallization and evaporation metallization. Process chambers can be freely selected to match the application.

CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.

CC-200/400 is a compact and easy-to-use system for R&D use and production.