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Ultra-High Vacuum Sputtering System for R&D
MPS Series


ULVAC's MPS Series are a new type developed using our wealth of experience and extensive sales record. Discharge can be maintained at a pressure, about one order of magnitude lower than the conventional sputter discharge pressure. The use of long throw sputtering enables better film thickness uniformity, and the diagonal incidence configuration is ideal for co-sputter and multilayer films.

Magnetic Multilayer Cluster Tool
MagestTM S200


MagestTM S200 provides the multi-layer deposition of ultra thin films under the ultra high vacuum condition and is applicable for the deposition of various materials by RF or DC sputtering.

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