ULVAC offers cutting-edge magnetic material processing technologies for magnetic sensors and for MRAM and other forms of nonvolatile memory.
ULVAC's MPS Series are a new type developed using our wealth of experience and extensive sales record. Discharge can be maintained at a pressure, about one order of magnitude lower than the conventional sputter discharge pressure. The use of long throw sputtering enables better film thickness uniformity, and the diagonal incidence configuration is ideal for co-sputter and multilayer films.
This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.
This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.