> Load-lock type Plasma-CVD System
Load-lock type Plasma-CVD System
CC-200/400 is a compact and easy-to-use system for R&D use and production.
- High-density plasma process on 27.12MHz
- Supports the deposition of SiH4 (SiO2, SiNx, SiON, a-Si ) and TEOS (SiO2).
- Supports the chamber cleaning by CF4+O2 plasma.
- Supports the heater for low-temperature deposition of organic EL.
- Supports various substrate sizes.
- Vacuum box-enabled indirect sequential processing within C-series (Sputter: CS-200, Evaporation: CV-200).
- Power devices
- Compound-related devices of LED, LD and highspeed devices
- Organic EL system for R&D use
- Solar battery system for R&D use