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LED Device

LED devices provide high intensity light and low power consumption, and are widely used in the fields of next-generation displays and lighting systems. ULVAC’s production technology contributes to the production of LED devices.

Etching

Compact Etcher for Reserch & Development
CE-L

CE-L

This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.

High-Density Plasma Etching System for R&D
NE-550EX

NE-550H

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Dry Etching Tool
APIOS NE-950EX

NE950EX

LED Mass Productive Dry Etching Tool NE-950EX

Dry Etching System for Production
NE-5700/NE-7800

ne7800h

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

Ashing

Ashing Systems
Luminous NA Series

NA-1300L full module

Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

Sputtering

Sputteing System for Optical Filters and Coating
ULDiS Series

ULDiS-s

The ULDiS series is the digital sputtering system that has enhanced the Meta Mode and realized the high-quality optical filters and coatings.

ULVAC has signed a License Agreement with JDS Uniphase Corporation of the U.S.

; License MetaMode® sputter for optical application. The ULDiS comes available to be placed at your business, and develops widely.

Batch-type Sputtering System
SX Series

sx-200

Batch-type Sputtering System SX series is for batch type sputtering system for research & development and small production application.

Compact Sputter
ACS-4000

ACS4000-equip

Compact sputtering system is available for research and development of multi layer thin film, compound materials or other devices, using automatic process operation by PC. Also more large size substrate (4 inch dia.) than ever system is available.

Compact Sputter for Research & Development
CS-L

cs-l

It is possible to arrange for various module conbination; Atmospheric cassette, Single piece, Atmospheric transfer, Vaccum transfer. Compact design integrated with control unit.

Batch-type Sputtering Systems
SV Series

sv

Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model, and carousel types for large-volume substrate processing.

Load-lock type Sputtering System
CS-200

CS200

Load-lock type Sputtering System CS 200 is for research & development and small production application.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.

Evaporation

Small Evaporation System for R&D
EX-200

EX_200

This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.

Load-lock type Evaporation System
CV-200

cv200

CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.

Batch-type High Vacuum Evaroration System
ei Series

ei

This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.

PE-CVD

Load-lock type Plasma-CVD System
CC-200/400

cc200400

CC-200/400 is a compact and easy-to-use system for R&D use and production.