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LED devices provide high intensity light and low power consumption, and are widely used in the fields of next-generation displays and lighting systems. ULVAC’s production technology contributes to the production of LED devices.
This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.
NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.
LED Mass Productive Dry Etching Tool NE-950EX
Dry etching system for high volume production with good cost performance and wide selection of tool configuration.
Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
The ULDiS series is the digital sputtering system that has enhanced the Meta Mode and realized the high-quality optical filters and coatings.
ULVAC has signed a License Agreement with JDS Uniphase Corporation of the U.S.
; License MetaMode® sputter for optical application. The ULDiS comes available to be placed at your business, and develops widely.
Batch-type Sputtering System SX series is for batch type sputtering system for research & development and small production application.
Compact sputtering system is available for research and development of multi layer thin film, compound materials or other devices, using automatic process operation by PC. Also more large size substrate (4 inch dia.) than ever system is available.
It is possible to arrange for various module conbination; Atmospheric cassette, Single piece, Atmospheric transfer, Vaccum transfer. Compact design integrated with control unit.
Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model, and carousel types for large-volume substrate processing.
Load-lock type Sputtering System CS 200 is for research & development and small production application.
SME-200E is cluster type Sputtering system for research and development and production purpose.
This is an evaporation system for R&D use for the deposition of metal films and oxide films by using an EB gun and resistance heating evaporation sources.
CV-200 consists of two chambers; a load-lock chamber and an evaporation chamber. Employing the load-lock type system enables the process to be carried out in a constantly clean environment. It also provides superior film repeatability. Application ranges from R&D use to small production.
This is a batch type high vacuum evaporation system for the deposition of metal and oxide on a substrate. Since the operation panel of this system has an integrated control function that realizes automated vacuum and deposition process, it is recommended for R&D use as well as for small-scale manufacturing.
CC-200/400 is a compact and easy-to-use system for R&D use and production.