Etching

Compact Etcher for Reserch & Development
CE-L

This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.

High-Density Plasma Etching System for R&D
NE-550EX

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Dry Etching System for Production
NE-5700/NE-7800

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

Dry Etching System for R&D
NLD-570

Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Dry Etching System for Opto-Devices, MEMS
NLD-5700

Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Si Deep Etching System
NLD-5700Si

This system enable deep Si etching using ULVAC original process, doesn't use Bosch process nor Cyro Genics process. This system is also available for quartz etching.

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Etching

Compact Etcher for Reserch & Development CE-L

High-Density Plasma Etching System for R&D NE-550EX

Dry Etching System for Production NE-5700/NE-7800

Dry Etching System for R&D NLD-570