EQUIPMENT

Top > EQUIPMENT > APPLICATIONS > Advanced Packaging Device > TSV >

TSV

Etching

Compact Etcher for Reserch & Development
CE-L

CE-L

This laboratory etching system is available with various combinations of features, such as atmospheric cassettes, single wafer atmospheric transfer, and vacuum transfer. With touch panel operation, it is possible to automatically control substrate transfer, evacuation, and etching. Small footprint thanks to integration of mechanical and electrial components.

High-Density Plasma Etching System for R&D
NE-550EX

NE-550H

NE550EX is a multipurpose high-density plasma etching system, especially for test facilities such as universities and government agencies.

Dry Etching System for Production
NE-5700/NE-7800

ne7800h

Dry etching system for high volume production with good cost performance and wide selection of tool configuration.

Dry Etching System for R&D
NLD-570

NLD570

Dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Dry Etching System for Opto-Devices, MEMS
NLD-5700

nld5700

Production type dry etching system with ULVAC original NLD (Neutral Loop Discharge) Plasma Source.

Si Deep Etching System
NLD-5700Si

nld-si

This system enable deep Si etching using ULVAC original process, doesn't use Bosch process nor Cyro Genics process. This system is also available for quartz etching.

Ashing

Ashing Systems
Luminous NA Series

NA-1300L full module

Luminous NA series ashing systems can be used for all sizes of wafers and are compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.

PE-CVD

Cluster-type PE-CVD System
CME-200E/400/500

cme200e

CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.

Load-lock type Plasma-CVD System
CC-200/400

cc200400

CC-200/400 is a compact and easy-to-use system for R&D use and production.

Sputtering

Multi Chamber Type Equipment
ENTRONTM N300

entron-n300

ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series. 

Backside Metalization Sputtering System
SRH Series

SRH-420

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Batch-type Sputtering Systems
SV Series

sv

Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model, and carousel types for large-volume substrate processing.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.