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CSP

PE-CVD

Cluster-type PE-CVD System
CME-200E/400/500

cme200e

CME-200E/400 is the most suitable model in the PE-CVD series production system for deposition of Si films with application as Insulator or barrier layers.

Load-lock type Plasma-CVD System
CC-200/400

cc200400

CC-200/400 is a compact and easy-to-use system for R&D use and production.

Sputtering

Multi Chamber Type Equipment
ENTRONTM N300

entron-n300

ENTRON N300 is the cluster type deposition system which equipped the process technology of next generation semiconductor. It offers the critical process of the next-generation semiconductor, such as “Cu Barrier Seed PVD for TSV”, “Aluminum Emitter Wiring PVD for Large Diameter Substrate Power Devices”, and “Aluminum Re-Distribution Layer PVD and Under Bump Metal PVD for High-Density Packaging”. Furthermore, all user will satisfied by the most environmentally-friendly concept as an aggregate of energy-saving technologies in ENTRON-series. 

Backside Metalization Sputtering System
SRH Series

SRH-420

SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.

Multi-chamber Sputtering System
MLXTM-3000N

mlx3000n

MLXTM-3000N meets customer's complicated requests by superior process flexibility and controllability, and excellent cost performance.

Batch-type Sputtering Systems
SV Series

sv

Vertical batch-type sputter systems. Series models include the SV-200 disk stamper model, and carousel types for large-volume substrate processing.

Cluster-type Sputtrering System
SME-200E

sme200e

SME-200E is cluster type Sputtering system for research and development and production purpose.