Reactive Gas Process Monitoring System Qulee RGM2-202 / RGM2-302
This process monitoring system has been developed for various kinds of applications such as etch, CVD and other reactive gas processes. Using ULVAC’s original ion source and pumping system enables you to achieve stable measurements results.
Long term stable measurements results
Closed Ion Source Utilizing a Magnetic Field: Soft ionization provides less gas dissociation and higher sensitivity. Decomposition and adsorption due to thermal reactions are minimized in the ionization chamber.
Short distance between the process chamber and ion source allows quick-response of analysis.
Wide pressure range from 10-6 to 13kPa is available. (Choice of orifices)
No need for PC
"One Click" function
Max 120ºC High temperature bakeing.
Electron bombard degas
Protection and maintenance of ion source and secondary electron multiplier
Traceability of analysis tube (patent pending)
Various Leak Tests are Available (Helium leak test, air leak test, leak up)
Capable of total pressure measurement (External ionization gauge GI-M2)
This software is included and compatible with (Windows 7,8,10)
For etching and CVD process
Monitoring reactive gases during process
End-point monitoring for etching and cleaning processes