1. Development of a Wet Rinse Unit-Equipped Dry Etcher for Metal Processes

Author Kenji KOMURO, et al., Advanced Electronics Equipment Division [PDF]
Abstruct With our dry etching equipment, high density plasma (5E10–1E11/cm3) can be generated at low pressure (0.07–13.3 Pa) by ISM (Inductive Super Magnetron) type plasma source, making it possible to achieve a uniform etching distribution using a magnet.
In this issue, we developed dry and wet composite mass production type dry etching equipment for high quality SAW filters.
A crucial feature of this device is that it is equipped with hardware that performs a combination of dry etch and wet etch processes in a low dew point environment to reduce the corrosion that is particularly likely to occur in composite metal films.

2. Development of a Cu Alloy Sputtering Target

Author Satoru TAKASAWA et al., Institute of Super Material [PDF]
Abstruct We have developed Cu alloy films with good adhesion to glass and resin substrates. For flat panel display (FPD) applications, particularly wiring material of the next generation high definition TV, high thermal resistance is required. Compared with the Cu/Ti and Cu/Mo films commonly used as thin film transistor (TFT) wiring metals, our newly developed the Cu alloy exhibits higher thermal resistance characteristics. In addition, for printed circuit board (PCB) applications, the new Cu alloy film contributes to cost reduction by simplifying the etching process compared with Cu/Ti film as the general wiring material.

3. Research on In-plane Thermoelectric Elements Using the Spin Seebeck Effect

Author Tatsuhiro NOZUE, et al., Future Technology Research Laboratory [PDF]
Abstruct We have investigated the thermoelectric elements using the spin Seebeck effect (SSE), in order to develop the novel thermoelectric device. The multilayered SSE elements of Y3Fe5O12 (YIG) and Pt, [YIG/Pt]n, were fabricated by sputtering. The sample of n = 2 had the SSE coefficient 2 times as large as that of n=1. However, the SSE of n = 3 sample was almost equal to that of n = 2. This enhancement of SSE is considered to be contributed by the spin current enhanced in the multilayer [YIG/Pt]n.

4. Development of Niobium Nitride Thin Film for Next-Generation Superconducting Acceleration Cavities

Author Ryohei ITO, et al., Future Technology Research Laboratory [PDF]
Abstruct S-I-S (superconductor-insulator-superconductor) multilayered structure theory has been proposed to achieve the maximum acceleration gradient of superconducting radio frequency cavities higher than the theoretical limit of conventional Nb cavities. In order to demonstrate this theory, we investigated the optimal deposition condition for reactive sputtering of NbN-SiO2 thin films and the correlation between the deposition conditions and the thin film properties. We finally made a multilayered sample consisting of NbN-SiO2 thin films and bulk Nb substrate, which has good crystalline orientation. Moreover, we clarified that the lower critical field of the multilayered sample was higher than a bulk Nb. In other words, we succeeded in demonstrating the S-I-S theory for the first time using a small sample size for measurement purposes.

5. “LS Series” Dry Vacuum Pumps with High Pumping Speed and Low Power Consumption

Author Tomonari TANAKA, et al., Research & Development [PDF]
Abstruct Dry vacuum pumps are used in many production lines, including those for electronic parts and displays. Environmental concerns have led to dry vacuum pumps becoming mainstream thanks to their low power consumption. However, typical dry vacuum pumps with low power consumption tend to have the problem of long pumping down time, since they have a low pumping speed near atmospheric pressure. To solve this problem, ULVAC has developed a new dry vacuum pump series called the LS series that combines high pumping speed with low power consumption. By increasing the pumping speed near atmospheric pressure, ULVAC has realized a dry vacuum pump with high pumping speed that uses the innovative technology developed by the company to reduce power consumption.