Sputtering System
Model： CS
This is a single-chamber sputtering system designed to support applications from research and development to small-scale production. It has been redesigned with a focus on ease of use, leveraging existing process data and expertise.
Features
- Supports multi-layer deposition.
- Capable of data logging.
- Substrate size: Up to Φ300mm (deposition performance is guaranteed up to Φ190mm).
- Automated multi-layer deposition enabled through recipe control.
- The load-lock chamber cassette can accommodate up to 5 trays, which are automatically transferred by a manipulator.
Applications
- R&D, and small-scale production for electronic components
