sputtering

Backside Metalization Sputtering System
SRH Series


SRH Series is production system for deposition of metallic films for power device, WL-CSP, or UBM or similar application.
FeaturesPage TOP

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Applicable substrate size: φ125 to 200mm.

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Capable of auto-transfer for Ultra-thin Si wafer up to 50μm thickness.

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Up to 5 unique process recipes.

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Sputter-Etching process developed by ISM.

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Efficient water cooling mechanism by ESC method is available.
ApplicationsPage TOP

・  Power device

・  WL-CSP (seed layer of electrolytic plating)

・  UBM (Barrier metal)

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