Process

Technology

Materials

Film Deposition

Supttering

Various materials（Al, Ti, V, Cr, Ni, Cu, Zr, Nb, Mo, Ag, Ta, W, Pt, Au, Pt-Pd, WSi, ITO, SUS, etc.）, dielectric materials(SiO₂、PZT)

CVD

SiO₂, SiN, SiON, TEOS, a-Si, CNT

Vacuum Evaporation

Various materials（Li, B, C, Mg, Al, Si, Sc, Ti、V, Cr, Fe, Co, Ni, Cu, Ge, Zr, Nb, Mo, Ru, Rh, Pd, Ag, In, Sn, Ta, W, Pt, Au, Bi）

Compound（SiO₂、TiO₂, Cr₂O₃, ITO、Ta₂O₅, ZuO）

Etching

Dry etching (NLD, ICP)

Si, deep etching of glass, various metals, sacrifice layer etching

Wet etching

HF, TMAH, KOH, Various materials

Chemical Surface Modification

nozzle, tips for chemical analysis, μ -TAS, Lab-On-A-Chips (DNA, peptide / protein)

Thermax Oxidation

Oxidization by precise Temperature Controlled Farnacle.

Annealing

Annealig in variovs conditions

Photolirhography

Simgle and Both side alignment available.
Sub-micron patterning by i-line stepper.
From Photmask fabrication To Finished Prodvcts.

Cleaning

UV, RCA, etc.

Anodic Bonding

Bonding of Si and Pyrex glass

Assembly

Dicing

Si, SiO₂, SiC, sapphire, etc.

Wire bonding

Au, Al wires

Measuring

Mass Spectrometry ＆amp; 3dimensional measurements available : (3D Laser Microscopy、SEM、Ellipsometry、Hg-probe,Wafer Particle-monitor ..)

Si, SiO₂, metals applicable

Surface Polishing

Plating, CMP

Various materials