■NEWS 2008

December 24, 2008 ULVAC-PHI and ULVAC have achieved
the world's first success in low-damage depth
profile analysis of organic molecular materials and
ceramic materials using XPS/ESCA equipped
with a GCIB gun

ULVAC-PHI, Inc.  ULVAC, Inc.
December 17, 2008 ULVAC, Inc. Announces its Establishment of
World’s First Solar Cell Modules Testing Laboratory
as an Equipment Manufacturer
with the Cooperation of TÜV Rheinland Japan Ltd.

ULVAC, Inc.
December 1, 2008 ULVAC and ULVAC Materials have Developed the World’s First Integrated Mass Production Technology for Thin-film Lithium Secondary Batteries
ULVAC, Inc.
December 1, 2008 ULVAC Introduces the High Productivity Resist/Residue Removal
Tool – ENVIROTM-Xceed400

ULVAC, Inc.
November 27, 2008 ULVAC launches the sale of LED mass-production-dedicated dry etching system NE-950EX
- Productivity up 140% over the current standard -

ULVAC, Inc.
October 27, 2008 ULVAC and Mitsubishi Materials Corporation jointly developed new TFT wiring technology
–New copper alloy target adopted to the new sputtering technology–

ULVAC, Inc.  Mitsubishi Materials Corporation
August 26, 2008 Energies are Savable in Vacuum Conveyance,
Replacing Air Ejectors and Rotary Vane Vacuum Pumps:
ULVAC markets a Large-displacement Rocking Piston Dry-Vacuum Pump in August 2008

ULVAC, Inc.
July 16, 2008 Thin Film Vacuum Distillation now available for Electronic Materials
–Announcing new type of centrifugal vacuum distillation system –

ULVAC, Inc.
June 30, 2008 ULVAC Ranked Fifth in VLSI Research's 10 BEST Awards for Large Suppliers of Wafer Processing Equipment
ULVAC, Inc.
May 21, 2008 World's First Simultaneous Measurement of In-plane Distribution of Seebeck Coefficient and Thermal Conductivity
- Development and commercialization of the STPM-1000 -

ULVAC, Inc.
May 21, 2008 Introducing a Sputtering System for Non-conductive metal coating
– Launch of a new sputtering system for functional decorative coating –

ULVAC, Inc.
May 13, 2008 Impact of the earthquake in Sichuan Province, China
ULVAC, Inc.
March 31, 2008 Developed and Commercialized of "Magrise": a Mass-Production System for the World’s Highest Grade Rare-Earth Permanent Magnets
–Launched the first system ever to improve magnet performance while saving Dy–

ULVAC, Inc.
March 27, 2008 UNewly Developed Carbon Nanotube Film Formation System for 300-mm Wafers
ULVAC, Inc.
February 7, 2008 ULVAC Developed the Cu Wiring Process for TFT
-Adhesion and Barrier Performance Improved by Oxygen-mixture Sputtering-

ULVAC, Inc.
January 28, 2008 Shinoda Plasma Establishing the Alliance System for PTA Commercialization, with Investment from ULVAC, Fujimori Kogyo, and Dyden
ULVAC, Inc.
January 16, 2008 Release of New Models of Inline Sputtering Systems Supporting 8.5th to 10th Generation CF Substrates Achieving High Throughput and Process Stability
ULVAC, Inc.