■NEWS 2002

December 17, 2002 Release of a High-temperature Etching Equipment for Mass Production of FeRAM
ULVAC, Inc.
December 17, 2002 Release of the MOCVD Equipment for Mass Production of FeRAM
ULVAC, Inc.
December 11, 2002 The surface analysis instruments manufacturer, ULVAC-PHI, INC., will buy the surface analysis instruments department of its parent company, PHYSICAL ELECTRONICS to expand into the world market as a wholly owned subsidiary of ULVAC, Inc.
ULVAC, Inc.
ULVAC-PHI, INC.
December 2, 2002 Development of Al Filling Technology Utilizing Aluminum (Al) CVD Technology
ULVAC, Inc.
December 2, 2002 Development of Ultra-high Vacuum Sputtering Equipment for Mass Production of TMR Films for MRAM
ULVAC, Inc.
December 2, 2002 Cu Wiring Technology by Bias Modulation SIS Method
ULVAC, Inc.
October 23, 2002 Establishment of the World's First Consortium for the Development and Commercialization of Next-Generation Functional Circuit Boards Using Nano Paste
ULVAC, Inc.
October 10, 2002 ULVAC Promotes Service Business in China
ULVAC, Inc.
September 25, 2002 An Industrial Plant to be Established in Hachinohe for Through Processing of Machining, Surface Finishing and Washing of Large Components
ULVAC, Inc.
June 28, 2002 Visible Light Responsive Photocatalytic Functional Films Developed Successfully
ULVAC,Inc.
March 12, 2002 Concluded a Contract with Litrex, a Leading Manufacturer of Ink Jet Printers for High-molecular OLED, for Sales, Service and Development
ULVAC, Inc.
March 4, 2002 Development of a Large-area High-intensity Flat-faced lamp
- Through application of the low resistance Super ITO film -

ULVAC, Inc.