Technology History|R&D|ULVAC, Inc.

Technology History

2022 July Selected for the NEDO G.I. Fund Project "Development of Next-generation Storage Batteries and Next-generation Motors" Project ~Development of Li anode production technology using unique vacuum deposition technology with focus on all-solid-state batteries~"
May ULVAC will be presenting on the newest of plasma technology to fabricate advanced packaging at ECTC 2022.
2021 September ULVAC, Inc. and Tokyo Institute of Technology Establish "ULVAC Advanced Technology Collaborative Research Cluster"
June The Technology Award from JIEP
April ULVAC will be presenting on the Control of material surface condition for plasma technology to fabricate advanced packaging at ICEP 2021
January ULVAC Launches to start selling the combined deposition and etch modules' system of cluster type for advanced electronics called "uGmni series"
-enabling to equip with a variety of different modules on the same transfer core-
2020 November STMicroelectronics Establishes World's First "Lab-in-Fab" to Advance Adoption of Piezoelectric MEMS in Singapore in Partnership with A*STAR and ULVAC
May ULVAC will be presenting on polyimide fine-via etching and low-damage surface-modification process for high-density FOWLP at ECTC2020
January ULVAC will be presenting on thin-film processing technologies of piezoelectoric materials at 33rd Micro Electro Mechanical Systems (IEEE MMS 2020)
2019 November ULVAC and IBM will be presenting on a novel metal gate technology at 65th International Electron Devices Meeting (IEDM2019)
October ULVAC launches Smartphone-Direct Pirani Gauge "SWU10-U"―Vacuum measurement more easily―
July ULVAC Launches Revolutionary PZT Piezoelectric Thin-film Process Technology and HVM Solution for MEMS Sensors /Actuators: Enabling Reliable, High-quality Film Production for Next Generation Devices,ULVAC: Advancing technologies to achieve smart societies
February Invited lecture in SPIE
2018 November Established ULVAC-Osaka University Joint Research Laboratory for Future Technology in Graduate School of Engineering, Osaka University
April ULVAC to Develop and Launch the LS series of Dry Vacuum Pumps - High pumping speed combined with low power consumption -
2017 June Agreement Signed to Establish Joint Research Office with the Chinese Academy of Sciences' Institute of Microelectronics
March S-QAM series of complex sputtering systems for R&D launched
Dry Etching System "NA-1500" for 600mm Advanced Packaging Substrates --- NA-1500 provides uniform Descum process for large square substrate
2015 July Established Future Technology Research Laboratory
April ULVAC, Inc. and Robert Bosch GmbH Sign Basic Agreement for Joint Development of Piezoelectric Device (PZT) for MEMS
2013 September At the 11th Excellent Contribution to Industry-Academia-Government Collaboration Award Ceremony, the National Institute of Advanced Industrial Science and Technology (AIST) and Fuji Electric Co., Ltd. Jointly Received the Japan Business Federation Chairman's Award.
2011 July Established the South Korea Institute for Super Materials as a research institute attached to ULVAC KOREA, Ltd. to enhance research and development in South Korea.
May Developed the portable small-scale power generation system
February Recipient of the first "Kanagawa Award for the Prevention of Global Warming" for Development of a photovoltaic quick-charging system for electric vehicles
2010 October Tie-up with Optorun to Fuel Sales of Optical Thin Film Deposition Systems
July Technical collaboration with a subsidiary of SABIC Innovative Plastics Holdings BV for mass production of plasma coating technology
June Japan's First JCSS Vacuum Gauge Calibration Laboratory
2009 January ULVAC's Turnkey Production Line of a-Si Thin film Solar Cell Received a Nihon Keizai Shimbun Awards for Excellence in the 2008 Nikkei Superior Products and Services Awards.
2008 December Developed the world's first integrated mass production technology for thin-film lithium secondary batteries
Introduced the high productivity resist/residue removal tool ENVIROTM-Xceed400
Announced the establishment of world's first solar cell modules testing laboratory as an equipment manufacturer with the vooperation of TÜV Rheinland Japan Ltd.
Launched the world's most sensitive residual gas analyzer/process monitor Labeled model number HGM-202 in the Qulee series, this top performer can be used in ultra high vacuum or extra-high vacuum environments.
November Launched the sale of LED mass-production-dedicated dry etching system NE-950EX: productivity up 140% over the current standard
July Launched the sales of CEH-400BII,new type of centrifugal vacuum distillation system
May Launched the sales of sputtering system for non-conductive metal coating
April Sales start of vacuum evaporation system for color reflectors
March Developed the carbon nanotube film formation system for 300-mm wafers
Developed and Launched the sales of "Magrise": a mass-production system for the world's highest grade rare-earth permanent magnets, the first system ever to improve magnet performance while saving Dy
February Developed the Cu wiring process for TFT: adhesion and barrier performance improved by Oxygen-mixture sputtering
January Release of new models of inline sputtering systems supporting 8.5th to 10th generation CF substrates achieving high throughput and process stability
2007 November Launched the sale of NE-950, the dry etching system dedicated for LED/LD mass-production targets five times productivity
October China Solar Power enters thin film solar cell market in China by forging strategic alliance with ULVAC, Inc. of Japan
August Developed a new process technology for manufacturing magnetic heads for next-generation HDDs
Sunner Solar Corporation is going to enter the solar energy market. ULVAC made a package contract for the production systems.
June Developed a new film formation technology for high-integrated PCRAM
-GST(Ge2 Sb2 Te5 )film embedding sputtering has been realized-
April The "Sputtering system SDP-s series for the 8th generation or later liquid crystal CF/PDP" won the grand prize for the ADY2007 production system department.
March NexPower Technology Corporation is going to enter the solar cell market. ULVAC made a package contract for the production systems.
January Launched the new-model sputtering system jsputter "JSP-8000"
2006 November Launched the new-model QCM based Modecular Interaction Analyzer "AFFINIX Q series" AFFINIX QN
October Extended deployment of leading edge optical coating platform
Developed the technology of growing an SiGe epitaxial layer at low temperature
Selective epitaxial SiGe application to SOI and source/drain possible -
September Marketing of long-life radio-frequency (RF) ion guns commenced.
Linear ion guns with improved initial discharge current characteristics launched.
Developed the new technology of manufacturing MEMS PZT piezoelectric devices.
Launched the Qulee (pronounced as "KLEE") Series, residual gas analysis/process gas monitor achieving ultra low-cost and pursuing facilitation and convenience.
Launched the sale of new-model sputtering equipment for automotive parts. Achieved high productivity by three-layer continuous processing, as well as space saving and environmental compliance.
July Launching the low k inter-layer insulating film materials and wafers with insulating film for next-generation LSI.
August Developed anti-corrosion treatment for Al alloy with little outgassing (Super AL-pika).
June New chromatogram processor ChromatoDAQ II designed for RoHS compliance, compactness and high performance was announced.
Latest Type Double-Arm Vacuum Transfer Robot ULSTA-300 with throughput improvement was announced.
2005 November ULVAC introduces two new models of ion implantation systems (SOPHI, IH‐860DSIC) into the power device market.
July The multi-purpose single-chamber vacuum heat treatment system (FHB series) mounting our technology, the high purity gas shield method, was brought to the domestic market.
May In the 5th awarding ceremony of the Japan Vacuum Industry Association, the "development of low-resistance ITO conductive film" won the FujiSankei Business i. president award and "contribution to vacuum system production using a Ti welding process" won the technique award.
The carbon nano tube growth system that allows the world's first vertical and selected growth on the board (for semiconductors) and the arc carbon nano tube (single wall type) production system were announced.
April New products, the liquid crystal dropping and gluing system "V series," PDP panel function tester "BM series," ashing system "NA-1000/1300," etching system "ALBA," and wafer bump inspection system "IS-300/3300" were announced.
2004 February A new license contract was concluded with JDS Uniphase Corporation.
2003 November The MEMS process line such as lithography was maintained and the integrated line from film deposition/etching to dicing and bonding was set up and MEMS foundry services were provided.
August The solid-state green laser anneal system for low-temperature poly-silicon/TFT was developed (with the "high-power 200W green laser oscillator" developed by Sanyo Electric Co., Ltd. mounted).
May Dry pump power-saving attachment [Eco-Shock] won the Third Japan Vacuum Industry Association/Japan Industrial Journal Chairman's Award for 2003Winner of Chairman's Award, Japan Machinery Federation's 23rd Award for Outstanding Environmental Machinery.
Polyimide film coverage technology using vapor deposition polymerization was developed.
January The dry pump power saving attachment "ECO-SHOCK" won the "23rd Japan machinery Federation presidential prize" of The Japan Machinery Federation.
2002 December Al filling technology using aluminum (Al) CVD technology was developed.
Ultra-high vacuum sputtering equipment for the mass production of TMR films for MRAM was developed.
Cu wiring technology using the bias modulation SIS (Self Ionized Sputtering) method was announced.
June Visible light photocatalysis film deposition and evaluation systems were announced.
March The large-area high-intensity flat-faced lamp was developed.
2001 July The large-scale film deposition system using the Cat-CVD method was developed.
March Compact and inexpensive liquid crystal implantation/sealing equipment for large-scale liquid crystal panels was announced.
2000 August The new model Low-K material was announced.
July VLSI Research, the semiconductor related audit corporation, selected us as one of the "10 companies that achieved excellent customer satisfaction in 2000," meaning that we have won their prizes for three successive years.
The organic EL generator "SATELLA" won the championship of the 5th Advanced Display of the Year in the equipment sector.
April Technical cooperation was established with Kodak and Sanyo Electric Co., Ltd. to develop organic EL display manufacturing equipment.
1999 November The inexpensive and compact metallization system for mass production, supporting 300 mm wafers, "ENTRON" was developed.
Sputter technology for the next-generation Cu wires "Self Ionized Sputtering (SIS)" was developed.
The Industrial Equipment Division obtained ISO 9001, which means all divisions and departments across the company were certified.
July VLSI Research, the semiconductor related audit corporation, selected us as one of the "10 companies that achieved excellent customer satisfaction in 1999," meaning that we have won their prizes for two successive years.
The "multi-cathode sputter (MCS)" for barrier film deposition for the next-generation Cu wires and "CVD technologies for WN" were developed.
The "plasma CVD system for low-temperature poly-silicon TFT production CMD-450BHT" won the '99 championship of the 4th Advanced Display of the Year.
April We tied up with Ramtron International Corporation to develop "a next-generation ferroelectric memory."
Semiconductor Equipment Division 2 obtained ISO 9001 certification.
March The Ultra-high Vacuum Division and Control Equipment Division obtained ISO 9001 certification.
1998 July VLSI Research, the semiconductor related audit corporation, appraised us as "the system supplier that has made the most outstanding improvements."
The sputtering system for LCD manufacturing "SMD-850" won the '98 Excellent Award of the 3rd Advanced Display of the Year.
The Electronics Equipment Group, Electronics Equipment Division 1, Electronics Equipment Division 2, Control Solution Division, Purchasing Department, Delivery Department and other related departments obtained ISO 9001 certification.
April The Components Division obtained ISO 9001 certification.
The NLD plasma source high-density etching system "NLD-8000/800" was developed.
1997 July The "MgO film evaporation system ECH series" for plasma displays won the '97 championship of the 2nd Advanced Display of the Year.
May Three organic EL generators were developed and launched.
April A cooperative development contract regarding highly dielectric thin film deposition was concluded with Ramtron International Corporation, aiming for mass production of FRAM, a next-generation semiconductor memory.
The helium leak detector "HELIOT" won the 27th New Machine Development award held by the Japan Society for the Promotion of Machine Industry.
1996 July "IL-100," the ion implantation system for manufacturing the next-generation liquid crystal display panels, won the '96 Excellent Award of the Advanced Display of the Year.
1995 September The helium leak detector "HELIOT 301" won the "1995 Good Design Product, Selected by the Ministry of International Trade and Industry."
April Fuji Susono plant obtained ISO 9001 certification.
February The sputtering system for manufacturing the liquid crystal display panels "SMD-450" won the Nikkei Excellent Product of the Year '94.
1994 September The low pressure long through sputter (LTS) method for the next-generation semiconductor processes was developed.
1993 October The method to accurately measure the materials for extra high vacuum, which emit extremely fewer gases, and those emitted gases was developed.
1993 May The high-performance sputter ion pump for the extra/ultra-high vacuum "Acter Pump" was launched.
January The vacuum degreasing cleaning system for de-chlorofluorocarbon/ethane was developed.
1991 December The CERAUS series, a multi-chamber deposition system for ultra-high vacuum used in semiconductor manufacturing was launched.
1990 January The Bank of Canada issued new 50-dollar bills with a bogus bill prevention device using our vacuum evaporation roll coater.
1989 August Tsukuba Institute for Super Materials developed a "high-molecular thin film using vapor deposition polymerization."
May The sputtering system for the low-resistance ITO films "SDP series" was developed.
1988 October The ashing system "UNA-2000" was developed.
May The sputtering system for the superconductive film deposition "SH series" was launched.
1987 December The magnetic levitation transport system was developed in collaboration with Yasukawa Electric Corporation.
September The metal CVD system ERA-1000 won the IR-100 and received an award in Chicago.
1985 December The world's first multi-chamber sputtering system MCH-9000 series was launched.
November Vacuum Metallurgical Co., Ltd. delivered a Ti alloy cast metal elbow casing, the heart of the H-II rocket engine.
March The vacuum pumping system for the critical plasma tester (JT-60) was delivered to the Japan Atomic Energy Research Institute, Naka laboratory.
1982 February The large current ion implantation system IM-80H was developed.
1980 September The super-sized vacuum heat treatment furnace for rockets was completed.
May The fully automatic helium leak detector was developed.
The photochemical smog chamber was developed and delivered to the Research Institute for Environmental Protection and received a letter of appreciation from the Minister of Construction.
1979 January The plasma CVD system was developed.
1976 October The cassette-to-cassette sputtering system was developed.
April An ion carburizing system was developed.
1975 October IBM in the U.S. placed a major order for the full automatic vacuum evaporation system.
June The first domestic ion implantation system was developed.
1974 December The pumping system for the atomic fusion laboratory was completed, which was to be delivered to the Japan Atomic Energy Research Institute, Tokai laboratory.
October The world's largest vapor-phase dryer was completed.
January Transparent conductive film was developed.
1970 October The high-frequency continuous sputtering system was developed.
February The world's largest plasticizer plant was completed.
January The mass-filter type mass spectrometer was developed.
1969 October The low-frequency dissolution degasification furnace (25 tons) was completed for the first time in Japan.
1968 December The automatic leak test (ALT) system was developed.
November The electrical lead for superconductive magnets was successfully developed, which was commissioned by the New Business Development Body.
1967 March The low-speed electronic diffraction device won the gold prize at the Leipzig international trade fair.
1965 November The large-scale space chamber was delivered to the space research lab at Tokyo University.
1963 November The titanium casting valve won the Agency of Industrial Science and Technology director's award.
1962 November The ultra high vacuum valve won the incentive award from the director-general of the Science and Technology Agency.
1961 March The "60 kW electron impact vacuum furnace" was completed, thanks to a subsidy from the Ministry of International Trade and Industry.
The compact diffusion pump won the incentive award from the director-general of the Science and Technology Agency.
1959 September The "study on vacuum melting metal casting furnace using uranium and uranium alloy" supported by an atomic energy subsidy from the Science and Technology Agency was successful.
1957 September The 100 kg induced heating vacuum furnace was produced domestically.
1954 November The rotary cooler was developed.
1952 August The company was established. At the same time, Hayashi Chikara and Hashimoto Koichi from the Sagane Lab at Tokyo University and Shibata Hideo from Kumagai Lab joined us.

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